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1

Physical design and assembly process development of a multichip package containing a light emitting diode (LED) array die

Bonda, R., Treliant Fang,, Kaskoun, K., Lytle, W.H., Marlin, B., Swan, G., Stafford, J.W., Tam, G.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1997

Language:

english

File:

PDF, 431 KB

english, 1997

2

Ethylene glycol ether free solder paste development

Bill Lytle, Treliant Fang, Li Li, Charles Zhang

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 1.41 MB

english, 2001

3

Polycyanate esters: Science and applications

Treliant Fang, David A. Shimp

Journal:

Progress in Polymer Science

Year:

1995

Language:

english

File:

PDF, 5.89 MB

english, 1995

4

Squeegee bump technology

Jong-Kai Lin,, Treliant Fang,, Bajaj, R.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 811 KB

english, 2002

5

Determination of molecular weight of nonlinear polymers by NMR spectroscopy: application on a polymer of 2,2-bis(4-cyanatophenyl)propane

Journal:

Year:

1990

Language:

english

File:

PDF, 408 KB

english, 1990

6

A New Permanganate-Free Slurry for GaN-SiC CMP Applications

Fang, Treliant, Chen, Ping Chung, Lee, Ming Hsun

Journal:

Materials Science Forum

Year:

2020

File:

PDF, 882 KB

2020

7

[IEEE 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 - Espoo, Finland (18-21 June 2000)] 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) - Anisotropic conductive adhesive films for flip chip on flex packages

Li Li,, Treliant Fang,

Year:

2000

Language:

english

File:

PDF, 1.48 MB

english, 2000

8

[IEEE 2000 50th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 2000)] 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) - Squeegee bump technology

Jong-Kai Lin,, Treliant Fang,, Bajaj, R.

Year:

2000

Language:

english

File:

PDF, 1.14 MB

english, 2000

9

Interactions of methane with ThO2SiO2 surface at 1073 K

Treliant Fang, Chuin-tih Yeh

Journal:

Journal of Catalysis

Year:

1981

Language:

english

File:

PDF, 183 KB

english, 1981

10

Catalytic Pyrolysis of Methane

Fang, Treliant, Yeh, Chuin-Tih

Journal:

Journal of the Chinese Chemical Society

Year:

1982

Language:

english

File:

PDF, 522 KB

english, 1982

11

[IEEE 2014 IEEE 60th Holm Conference on Electrical Contacts (Holm) - New Orleans, LA, USA (2014.10.12-2014.10.15)] 2014 IEEE 60th Holm Conference on Electrical Contacts (Holm) - Electroless silver plating and in-situ SEM characterization of CNT-metal hybrid contactors

Yaglioglu, Onnik, Fang, Treliant, Martens, Rod, Eldridge, Ben

Year:

2014

Language:

english

File:

PDF, 1.31 MB

english, 2014

12

Poly(3-phenylquinoxaline): a new thermally stable polymer

Journal:

Year:

1991

Language:

english

File:

PDF, 621 KB

english, 1991

13

Characterization of a carboxyl-terminated butadiene-acrylonitrile copolymer by two-dimensional nuclear magnetic resonance

Journal:

Year:

1990

Language:

english

File:

PDF, 911 KB

english, 1990

14

Heptacene: Characterization in Solution, in the Solid State, and in Films

Einholz, Ralf, Fang, Treliant, Berger, Robert, Grüninger, Peter, Früh, Andreas, Chassé, Thomas, Fink, Reinhold F., Bettinger, Holger F.

Journal:

Journal of the American Chemical Society

Year:

2017

Language:

english

File:

PDF, 2.83 MB

english, 2017

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